ロングテック株式会社 product https://www.longtech-japan.com/en/product/ product ja 2026-09-26T11:11:00+09:00 Optical Glass https://www.longtech-japan.com/en/product/2023/03/91505/ Cerium Oxide Abrasive Main Applications Product Features ・High grinding speed for enhanced productivity ・Excellent grinding quality to minimize surface scratches ・Excellent dispersion stability for reduced sedimentation and easy redispersion ・Excellent polishing performance and long service life ・Contributes to improved product yield Product Series（Red） Product Series（White） Cerium Oxide Slurry Main Applications ・High-precision polishing of blue glass and various optical filters ・High-precision polishing of optical glass for liquid crystal panels ・High-precision and ultra-fine surface polishing of optical lenses ・High-precision polishing of photomasks, HDD disks, and final surfaces ・High-precision polishing of lenses for surveillance cameras Product Features ・High-quality polishing with no scratches ・Excellent washability and reduced residue ・Excellent dispersion stability ・Low sedimentation and easy redispersion ・Effective suppression of defect generation ・Improved processing yield Product Series（Red） Product Series（White） Product Technical Data Sheet CONTACT US Tel.06-6123-1110 Business Hours: 10:00-18:00 Closed: Saturday & Sunday Contact Form 2023-03-24T13:25:00+09:00 Cerium Oxide Abrasive

Main Applications

Product Features

・High grinding speed for enhanced productivity
・Excellent grinding quality to minimize surface scratches
・Excellent dispersion stability for reduced sedimentation and easy redispersion
・Excellent polishing performance and long service life
・Contributes to improved product yield

Product Series（Red）

酸化セリウム砥粒赤

Product Series（White）

酸化セリウム砥粒白

Cerium Oxide Slurry

Main Applications

・High-precision polishing of blue glass and various optical filters
・High-precision polishing of optical glass for liquid crystal panels
・High-precision and ultra-fine surface polishing of optical lenses
・High-precision polishing of photomasks, HDD disks, and final surfaces
・High-precision polishing of lenses for surveillance cameras

Product Features

・High-quality polishing with no scratches
・Excellent washability and reduced residue
・Excellent dispersion stability
・Low sedimentation and easy redispersion
・Effective suppression of defect generation
・Improved processing yield

Product Series（Red）

酸化セリウムスラリー赤

Product Series（White）

酸化セリウムスラリー白

Product Technical Data Sheet

CONTACT US

Tel.06-6123-1110

Business Hours: 10:00-18:00
Closed: Saturday & Sunday

]]> Semiconductor https://www.longtech-japan.com/en/product/2023/03/91506/ High-Purity Cerium Oxide Abrasive Technical Capabilities 01    Particle Size Control Advanced particle size control technology enables a narrow particle size distribution and excellent dispersion stability. 02  Particle Shape Control High-precision control of various particle shapes, including spherical, triangular, hexagonal, and cubic particles. 03  Diverse Manufacturing             Processes We support various manufacturing processes, including calcination and sol-gel methods, and are also developing composite particles. 04   Integrated Production                  System We have established an integrated production system covering synthesis, calcination, dispersion, and ultra-precision classification. Products for STI / ILD Planarization Processes at 14 nm and Above Products for STI / ILD Planarization Processes at 14 nm and Below Semiconductor Wafer Slurry CMP Slurries for Coarse and Fine Polishing of SiC Substrates and Si Wafers Benchmark Evaluation Evaluation Conditions: ・Equipment: 16B DSP Double-Sided Polishing Machine ・Polishing Pad: DuPont SUBA800 ・Substrate: 14 × 6-inch SiC wafers ・Polishing Time: 3 hours ・Platen Rotation Speed: 35 rpm Process Performance by Product: CONTACT US Tel.06-6123-1110 Business Hours: 10:00-18:00 Closed: Saturday & Sunday Contact Form 2023-03-23T13:25:00+09:00 High-Purity Cerium Oxide Abrasive

Technical Capabilities

01
技術ーサイズ

   Particle Size Control
Advanced particle size control technology enables a narrow particle size distribution and excellent dispersion stability.

02
技術ー形

 Particle Shape Control
High-precision control of various particle shapes, including spherical, triangular, hexagonal, and cubic particles.

03
技術ー生産技術

 Diverse Manufacturing             Processes
We support various manufacturing processes, including calcination and sol-gel methods, and are also developing composite particles.

04
技術ー全工程

  Integrated Production                  System
We have established an integrated production system covering synthesis, calcination, dispersion, and ultra-precision classification.

Products for STI / ILD Planarization Processes at 14 nm and Above

珠峰

Products for STI / ILD Planarization Processes at 14 nm and Below

长江

Semiconductor Wafer Slurry

CMP Slurries for Coarse and Fine Polishing of SiC Substrates and Si Wafers

半導体スラリー

Benchmark Evaluation


Evaluation Conditions:
・Equipment: 16B DSP Double-Sided Polishing Machine
・Polishing Pad: DuPont SUBA800
・Substrate: 14 × 6-inch SiC wafers
・Polishing Time: 3 hours
・Platen Rotation Speed: 35 rpm

ベンチマーク評価

Process Performance by Product:

当社製品のプロセス別性能

CONTACT US

Tel.06-6123-1110

Business Hours: 10:00-18:00
Closed: Saturday & Sunday

]]> Lapping /Polishing Carrier https://www.longtech-japan.com/en/product/2023/03/91500/ LTP specialized in ultra precision carrier manufacturing for double-sided polishing and  lapping processes, we are proud to offer materials with the tightest thickness  tolerance variation available in the market place. our overall system flexibility provides  customers with highly customized products and services to support their rapidly  changing manufacturing environment.Our insert carriers are manufactured for a wide variety of double-sided lapping and  polishing machines including: Hamai, Speedfam, Peter Wolters, P.R. Hoffman,  Spitfire, Norton, Fujikoshi, Lapmaster, MoriNaga, HRT, Melchiorre and others. APPLICATION Optical Glass / Wafer Glass Substrate Silicon Wafer LCD Glass Crystal / Sapphire Substrate Precision Metal Parts Ceramic Parts Hard Disk Drive OPTIONS Spring Steel / Stainless Steel / CRS FR-4 / G-10 Phenolic / Paper, Linen, Canvas PVC / Polycarbonate / Vinyl   Metal Alloy with Polymer Insert Coated Type with Aramid Fiber MCRF(Mounted Carrier with Reinforced Fiber) Patented Production - Specially for substrates  less than 0.3mmT REGULAR TYPES FR-4 / G-10 / PVC / Polycarbonate / Vinyl Spring Steel / Blue Steel Stainless Steel CONTACT US Tel.06-6123-1110 Business Hours: 10:00-18:00Closed: Saturday & Sunday Contact Form 2023-03-20T15:00:00+09:00

LTP specialized in ultra precision carrier manufacturing for double-sided polishing and  lapping processes, we are proud to offer materials with the tightest thickness  tolerance variation available in the market place. our overall system flexibility provides  customers with highly customized products and services to support their rapidly  changing manufacturing environment.

Our insert carriers are manufactured for a wide variety of double-sided lapping and  polishing machines including: Hamai, Speedfam, Peter Wolters, P.R. Hoffman,  Spitfire, Norton, Fujikoshi, Lapmaster, MoriNaga, HRT, Melchiorre and others.

APPLICATION

  • Optical Glass / Wafer Glass Substrate
  • Silicon Wafer
  • LCD Glass
  • Crystal / Sapphire Substrate
  • Precision Metal Parts
  • Ceramic Parts
  • Hard Disk Drive

OPTIONS

  • Spring Steel / Stainless Steel / CRS
  • FR-4 / G-10
  • Phenolic / Paper, Linen, Canvas
  • PVC / Polycarbonate / Vinyl  
  • Metal Alloy with Polymer Insert
  • Coated Type with Aramid Fiber
  • MCRF(Mounted Carrier with Reinforced Fiber)
  • Patented Production - Specially for substrates  less than 0.3mmT

REGULAR TYPES

  • FR-4 / G-10 / PVC / Polycarbonate / Vinyl
  • Spring Steel / Blue Steel
  • Stainless Steel

CONTACT US

Tel.06-6123-1110

Business Hours: 10:00-18:00
Closed: Saturday & Sunday

]]> Lapping /Polishing Carrier-Insert Carrier https://www.longtech-japan.com/en/product/2023/03/91501/ Insert Carriers are widely used in wafer grinding & Polishing  processes to protect the edge of the wafer from damaging . FEATURES Insert Materials: PA, POM, PU, etc.(Reinforced with Glass Fiber, Aramid Fiber, Teflon, etc.) Body Materials: SK5, CK75, CK101 etc. Thickness available from 0.250mm up to 1.270mm Fit for wafer size from 100mm up to 450mm Improving wafer performance on TTV / TIR Minimize the wafer edge damage SERIES Model Gear  Model Number Of Teeth Outer Diameter Pressure  Angle 17BM M2.5 176 445.00 20 18BM M3 150 456.00 20 20BM M3 170 516.00 20 21BM M3 177 537.00 20 22BM M2.5 220 555.00 20 24BM M4 152 616.00 20 26BM M4 166 672.00 20 28BM M4 178 720.00 20 30BM M4 191 772.00 20 32BM M5 162 820.00 20 Model Gear  Model Number Of Teeth Outer Diameter Pressure  Angle 2BM M2 22 48.00 20 3BM M2 34 72 20 3BM-45T M1.5 45 70.5 20 4B-14.5 M2 50 104.00 14.5 4BM M2 50 104.00 20 4BM-80T M1.25 80 102.50 20 5BM M2 53 110.00 20 6BM M2 70 144.00 20 9BM M2 114 232.00 20 15BM M3 128 390.00 20 CONTACT US Tel.06-6123-1110 Business Hours: 10:00-18:00Closed: Saturday & Sunday Contact Form 2023-03-11T11:05:00+09:00
Lapping Polishing Carrier-Insert Carrier右

Insert Carriers are widely used in wafer grinding & Polishing  processes to protect the edge of the wafer from damaging .

FEATURES

  • Insert Materials: PA, POM, PU, etc.(Reinforced with Glass Fiber, Aramid Fiber, Teflon, etc.)
  • Body Materials: SK5, CK75, CK101 etc.
  • Thickness available from 0.250mm up to 1.270mm
  • Fit for wafer size from 100mm up to 450mm
  • Improving wafer performance on TTV / TIR
  • Minimize the wafer edge damage

SERIES

Model Gear  Model Number Of Teeth Outer Diameter Pressure  Angle
17BM M2.5 176 445.00 20
18BM M3 150 456.00 20
20BM M3 170 516.00 20
21BM M3 177 537.00 20
22BM M2.5 220 555.00 20
24BM M4 152 616.00 20
26BM M4 166 672.00 20
28BM M4 178 720.00 20
30BM M4 191 772.00 20
32BM M5 162 820.00 20
Model Gear  Model Number Of Teeth Outer Diameter Pressure  Angle
2BM M2 22 48.00 20
3BM M2 34 72 20
3BM-45T M1.5 45 70.5 20
4B-14.5 M2 50 104.00 14.5
4BM M2 50 104.00 20
4BM-80T M1.25 80 102.50 20
5BM M2 53 110.00 20
6BM M2 70 144.00 20
9BM M2 114 232.00 20
15BM M3 128 390.00 20

CONTACT US

Tel.06-6123-1110

Business Hours: 10:00-18:00
Closed: Saturday & Sunday

]]> Lapping /Polishing Carrier-Mounted Carrier https://www.longtech-japan.com/en/product/2023/02/91502/ Mounted carriers are most specically used in Glass & Substrate polishing  processes to protect the edge of the glass and other fragile products from  chipping and other damages. FEATURES Thickness available from 0.1mm up to 1.2mm Body Materials: SUS304 Fit for workpieces size from 100mm up to 450mm Improving workpiece performance on TTV / TIR Minimize the products edge damage High precise mounted Perfect mounting strength and durability SERIES Model Gear  Model Number  Of Teeth Outer  Diameter Pressure  Angle 2B DP12 21 48.68 20 3B DP12 32 71.97 20 5B DP12 50 110.07 20 6B DP12 66 143.93 20 7B DP12 85 184.15 20 9B DP12 108 232.83 20 12B DP12 134 287.87 20 13B DP12 147 315.38 20 Model Gear  Model Number  Of Teeth Outer  Diameter Pressure  Angle 14B DP12 172 368.30 20 15B DP12 182 389.47 20 16B DP12 200 427.07 20 2S M1.25 38 50 20 3S M1.25 55 71.25 20 5S M1.5 70 108.00 20 6S M1.5 90 142.50 20 CONTACT US Tel.06-6123-1110 Business Hours: 10:00-18:00Closed: Saturday & Sunday Contact Form 2023-02-28T05:05:00+09:00
Lapping Polishing Carrier -Mounted Carrier左
Lapping Polishing Carrier-Mounted Carrier右

Mounted carriers are most specically used in Glass & Substrate polishing  processes to protect the edge of the glass and other fragile products from  chipping and other damages.

FEATURES

  • Thickness available from 0.1mm up to 1.2mm
  • Body Materials: SUS304
  • Fit for workpieces size from 100mm up to 450mm
  • Improving workpiece performance on TTV / TIR
  • Minimize the products edge damage
  • High precise mounted
  • Perfect mounting strength and durability

SERIES

Model Gear  Model Number  Of Teeth Outer  Diameter Pressure  Angle
2B DP12 21 48.68 20
3B DP12 32 71.97 20
5B DP12 50 110.07 20
6B DP12 66 143.93 20
7B DP12 85 184.15 20
9B DP12 108 232.83 20
12B DP12 134 287.87 20
13B DP12 147 315.38 20
Model Gear  Model Number  Of Teeth Outer  Diameter Pressure  Angle
14B DP12 172 368.30 20
15B DP12 182 389.47 20
16B DP12 200 427.07 20
2S M1.25 38 50 20
3S M1.25 55 71.25 20
5S M1.5 70 108.00 20
6S M1.5 90 142.50 20

CONTACT US

Tel.06-6123-1110

Business Hours: 10:00-18:00
Closed: Saturday & Sunday

]]> DLC Coated DSP Carrier https://www.longtech-japan.com/en/product/2022/08/91503/ DLC coated DSP carriers are specifically used for 300mm silicon wafer polishing, benefit from  its extreme hardness, brilliant abrasive resistance, and exclusive properties of MOE(Modulus  of Elasticity)/COF(Coefficient of Friction), etc. FEATURES Body Materials: Stainless steel / Carbon steel Insert Materials: Polyamide; PVDF Combination of stainless steel strength and polymer carrier strength No Metal Contamination DLC blocks off metals coming out from steel or carbon body Coating Thickness: 2.5±1μm High Hardness: 2000HV Friction Coefficient: 0.045 Improving wafer performance on TTV / TIR CONTACT US Tel.06-6123-1110 Business Hours: 10:00-18:00Closed: Saturday & Sunday Contact Form 2022-08-06T13:00:00+09:00


DLC coated DSP carriers are specifically used for 300mm silicon wafer polishing, benefit from  its extreme hardness, brilliant abrasive resistance, and exclusive properties of MOE
(Modulus  of Elasticity)/COF(Coefficient of Friction), etc.

FEATURES

  • Body Materials: Stainless steel / Carbon steel
  • Insert Materials: Polyamide; PVDF Combination of stainless steel strength and polymer carrier strength
  • No Metal Contamination
  • DLC blocks off metals coming out from steel or carbon body
  • Coating Thickness: 2.5±1μm
  • High Hardness: 2000HV
  • Friction Coefficient: 0.045
  • Improving wafer performance on TTV / TIR

CONTACT US

Tel.06-6123-1110

Business Hours: 10:00-18:00
Closed: Saturday & Sunday

]]> Equipment Front End Module https://www.longtech-japan.com/en/product/2022/08/102808/ Basic Functions ・Fully Automatic Loading/Unloading of 12-inch Wafers・In-tool cleaning with ultrasonic brush + drying・Supports in-situ Dry-in / Dry-out・SECS/GEM compliant with data visualization and              traceability・AGV/OHT compatible interface Equipment Configuration Equipment Operation Diagram Frame Type Options                                  Closed Type✓ Suitable for 5S and cleanroom environments△ Increased equipment cost＊Designed with a folding mechanism that does not interfere with the replacement of the upper Lapper plate.                                     Open Type✓ Simple structure△ Risk of environmental impact due to processing dust Basic Equipment Specifications 2022-08-03T14:15:00+09:00 Basic Functions


・Fully Automatic Loading/Unloading of 12-inch Wafers
・In-tool cleaning with ultrasonic brush + drying
・Supports in-situ Dry-in / Dry-out
・SECS/GEM compliant with data visualization and              traceability
・AGV/OHT compatible interface

画像7

Equipment Configuration

装置構成

Equipment Operation Diagram

装置稼働

Frame Type Options

オプション１

                                 Closed Type
✓ Suitable for 5S and cleanroom environments
△ Increased equipment cost

＊Designed with a folding mechanism that does not interfere with the replacement of the upper Lapper plate.

オプション２

                                    Open Type
✓ Simple structure
△ Risk of environmental impact due to processing dust

Basic Equipment Specifications

基本仕様
]]> Wafer Frame/Metal Film Frame https://www.longtech-japan.com/en/product/2021/08/91504/ FEATURES SUS420J2 Excellent in rust resistance High concentricity Durable Impact Resistance Temperature Resistance Chemical Resistance (Optional) Ability to handle 150mm, 200mm, and 300mm wafers. Compatible with frames handling  equipment(Disco, TSK, ADT, etc)  Customizable SERIES Industrial Standards Long-Tech Order Code Wafer Size Square Blocking Frame ID Frame Thickness Hardness Surface Finish DISCO 2-12-1 WF-012-S0* 12' 380mm 350mm 1.5mm HRC47-53 S01~S08 2-8-1 WF-008-S0* 8' 276mm 250mm 1.2/1.5mm HRC47-53 S01~S08 2-6-1 WF-006-S0* 6' 212mm 194mm 1.2/1.5mm HRC47-53 S01~S08 2-6 WF-006-S0* 6' 195mm 175mm 1.0/1.2mm HRC47-53 S01~S08 2-5 WF-005-S0* 5' 190mm 165mm 1.0/1.2mm HRC47-53 S01~S08 K&S 350-104 WF-104-S0* 8' 266.7mm 242.4mm 1.2/1.5mm HRC47-53 S01~S08 350-103 WF-103-S0* 6' 215.9mm 192.5mm 1.2/1.5mm HRC47-53 S01~S08 350-102 WF-102-S0* 5' 184.15mm 165.1mm 1.0/1.2mm HRC47-53 S01~S08 - WF-800-S0* 8' 276mm 255mm 1.2mm HRC47-53 S01~S08 - WF-018-S0* 18' 556mm 506mm 2.0mm HRC47-53 S01~S08 Remark: S01→Shiny ; S02→B Polish ; S03→Hair-Line ; S04→Matt Polish ; S05→Round Wire ; S06→Nickel Plated ;  S07→Mirror ; S08→Electropolishing CONTACT US Tel.06-6123-1110 Business Hours: 10:00-18:00Closed: Saturday & Sunday Contact Form 2021-08-06T13:00:00+09:00

FEATURES

  • SUS420J2
  • Excellent in rust resistance
  • High concentricity
  • Durable
  • Impact Resistance
  • Temperature Resistance
  • Chemical Resistance (Optional)
  • Ability to handle 150mm, 200mm, and 300mm wafers.
  • Compatible with frames handling  equipment
    (Disco, TSK, ADT, etc) 
  • Customizable

SERIES

Industrial
Standards		 Long-Tech
Order Code		 Wafer
Size		 Square
Blocking		 Frame
ID		 Frame
Thickness		 Hardness Surface
Finish
DISCO
2-12-1 WF-012-S0* 12' 380mm 350mm 1.5mm HRC47-53 S01~S08
2-8-1 WF-008-S0* 8' 276mm 250mm 1.2/1.5mm HRC47-53 S01~S08
2-6-1 WF-006-S0* 6' 212mm 194mm 1.2/1.5mm HRC47-53 S01~S08
2-6 WF-006-S0* 6' 195mm 175mm 1.0/1.2mm HRC47-53 S01~S08
2-5 WF-005-S0* 5' 190mm 165mm 1.0/1.2mm HRC47-53 S01~S08
K&S
350-104 WF-104-S0* 8' 266.7mm 242.4mm 1.2/1.5mm HRC47-53 S01~S08
350-103 WF-103-S0* 6' 215.9mm 192.5mm 1.2/1.5mm HRC47-53 S01~S08
350-102 WF-102-S0* 5' 184.15mm 165.1mm 1.0/1.2mm HRC47-53 S01~S08
- WF-800-S0* 8' 276mm 255mm 1.2mm HRC47-53 S01~S08
- WF-018-S0* 18' 556mm 506mm 2.0mm HRC47-53 S01~S08

Remark: S01→Shiny ; S02→B Polish ; S03→Hair-Line ; S04→Matt Polish ; S05→Round Wire ; S06→Nickel Plated ;  S07→Mirror ; S08→Electropolishing

CONTACT US

Tel.06-6123-1110

Business Hours: 10:00-18:00
Closed: Saturday & Sunday

]]> Hexagon Resin Pad https://www.longtech-japan.com/en/product/2020/06/91507/ Hexagon Resin Pad：LTP-HRP-A101 Diamond Polishing Slurry：LTP-DPS-A102 For Sapphire, SiC, Glassy materials and CrystalsThis product is mainly used with LTP-DPS-A102 Polishing Slurry; As an effective polishing tool for lapping section of plane grinding; It can better store liquid and increase the grinding efficiency of the plane by 50%. SERIES LONG-TECH Order Code Material Color Attachment Type Equipment Machines Overall Diameter (Imperial) Application Category LTP-HRP-A101 Resin White PSA Biplanar Grinder 640mm・940mm・1200-1290mm・Can be customized Finishing or polishing for Sapphire,SiC・glassy materials and crystals... CONTACT US Tel.06-6123-1110 Business Hours: 10:00-18:00Closed: Saturday & Sunday Contact Form 2020-06-07T13:30:00+09:00
Hexagon Resin Pad上
Hexagon Resin Pad下
  • Hexagon Resin Pad：LTP-HRP-A101
  • Diamond Polishing Slurry：LTP-DPS-A102
  • For Sapphire, SiC, Glassy materials and Crystals
  • This product is mainly used with LTP-DPS-A102 Polishing Slurry; As an effective polishing tool for lapping section of plane grinding; It can better store liquid and increase the grinding efficiency of the plane by 50%.

SERIES

LONG-TECH
Order Code		 Material Color Attachment
Type		 Equipment
Machines		 Overall Diameter
(Imperial)		 Application
Category

LTP-HRP-A101

 Resin White PSA Biplanar
Grinder		 640mm・940mm・1200-1290mm・Can be customized Finishing or polishing for Sapphire,SiC・glassy materials and crystals...

CONTACT US

Tel.06-6123-1110

Business Hours: 10:00-18:00
Closed: Saturday & Sunday

]]> Diamond Grinding Pad https://www.longtech-japan.com/en/product/2020/05/91508/ Diamond Grinding Pad for glass, glassy materials and crystals. LTP-DGP-A103 is an innovative and highly efficient diamond grinding pad suitable for fine grinding of optical glass, BK7, fused silica, glass-ceramics as well as crystalline and brittle glassy materials. LTP- DGP-A103 generates a high and consistent removal over its entire service life as well as impressive surface qualities and edge sharpening. Thanks to its long service life and easy handling, LTP-DGP-A103 is an economical and efficient alternative to thin abrasive films or conventional lapping processes.   CONTACT US Tel.06-6123-1110 Business Hours: 10:00-18:00 Closed: Saturday & Sunday Contact Form 2020-05-07T13:30:00+09:00
  • Diamond Grinding Pad for glass, glassy materials and crystals.
  • LTP-DGP-A103 is an innovative and highly efficient diamond grinding pad suitable for fine grinding of optical glass, BK7, fused silica, glass-ceramics as well as crystalline and brittle glassy materials.
    LTP- DGP-A103 generates a high and consistent removal over its entire service life as well as impressive surface qualities and edge sharpening. Thanks to its long service life and easy handling, LTP-DGP-A103 is an economical and efficient alternative to thin abrasive films or conventional lapping processes.  

CONTACT US

Tel.06-6123-1110

Business Hours: 10:00-18:00
Closed: Saturday & Sunday

]]> SiC Wafer https://www.longtech-japan.com/en/product/2020/02/91518/                High Quailty P Grade 100mm  4/6/8inch                                New Supply 4/6/8 inch SiC Wafer Device Application-Specific Required Specifications Item 650V 1200V 1700V Main application MOSFET / SBD / JBS MOSFET / SBD / JBS MOSFET / PiN Substrate type 4H-SiC n-type 4H-SiC n-type 4H-SiC n-type Resistivity (Ω·cm) 0.01–0.03 0.02–0.05 0.05–0.10 Micropipe 0 0 0 BPD density (cm⁻²) 0.5 0.2 0.1 TSD/TED Below control limit Below control limit Extremely low Wafer diameter 150 / 200 mm 150 / 200 mm 150 / 200 mm Off-angle 4° ± 0.1° 4° ± 0.1° 4° ± 0.1° Surface roughness RMS 0.2 nm 0.15 nm 0.1 nm TTV 5 µm 4 µm 3 µm Bow / Warp 30 µm 30 µm 25 µm CONTACT US Tel.06-6123-1110 Business Hours: 10:00-18:00 Closed: Saturday & Sunday Contact Form 2020-02-06T14:25:00+09:00
               High Quailty P Grade 100mm  4/6/8inch
                               New Supply 4/6/8 inch

SiC Wafer Device Application-Specific Required Specifications

Item 650V 1200V 1700V
Main application MOSFET / SBD / JBS MOSFET / SBD / JBS MOSFET / PiN
Substrate type 4H-SiC n-type 4H-SiC n-type 4H-SiC n-type
Resistivity (Ω·cm) 0.01–0.03 0.02–0.05 0.05–0.10
Micropipe 0 0 0
BPD density (cm⁻²) 0.5 0.2 0.1
TSD/TED Below control limit Below control limit Extremely low
Wafer diameter 150 / 200 mm 150 / 200 mm 150 / 200 mm
Off-angle 4° ± 0.1° 4° ± 0.1° 4° ± 0.1°
Surface roughness RMS 0.2 nm 0.15 nm 0.1 nm
TTV 5 µm 4 µm 3 µm
Bow / Warp 30 µm 30 µm 25 µm

CONTACT US

Tel.06-6123-1110

Business Hours: 10:00-18:00
Closed: Saturday & Sunday

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