product

・Fully Automatic Loading/Unloading of 12-inch Wafers
・In-tool cleaning with ultrasonic brush + drying
・Supports in-situ Dry-in / Dry-out
・SECS/GEM compliant with data visualization and              traceability
・AGV/OHT compatible interface

                                 Closed Type
✓ Suitable for 5S and cleanroom environments
△ Increased equipment cost

＊Designed with a folding mechanism that does not interfere with the replacement of the upper Lapper plate.

                                    Open Type
✓ Simple structure
△ Risk of environmental impact due to processing dust