ロングテック株式会社

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Lapping /Polishing Carrier

Lapping /Polishing Carrier-Insert Carrier

Lapping /Polishing Carrier-Mounted Carrier

DLC Coated DSP Carrier

Wafer Frame/Metal Film Frame

Nano Cerium Oxide CMP Abrasives

DPS Diamond Powder and Slurry

Hexagon Resin Pad

Diamond Grinding Pad

Quartz Jig

SiC Wafer

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Longtech Corporation.
〒541-0046
2-3-7 Hiranocho, Chuo-ku, Osaka City, Osaka Prefecture
Urban Ace Kitahama Building 1st floor
TEL 06-6123-1110

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